COM Express Type 6 is the reference computer-on-module standard for high-performance x86 embedded systems. It comes in two main sizes: Compact (95 × 95 mm) and Basic (125 × 95 mm), balancing functional density and thermal dissipation for modern multi-core processors.
Type 6 supports a wide range of CPUs, from low-TDP Intel Atom® and AMD Ryzen™ Embedded up to latest-generation Intel® Core™ i3/i5/i7 and Xeon® (up to 16 cores, TDP up to 54 W), with DDR4/DDR5 SODIMM or soldered memory (up to 128 GB, optional ECC). Many modules integrate powerful GPUs (Intel Iris Xe, Arc, AMD Radeon) and NPUs for AI.
Type 6 modules operate from -40 to +85 °C, resist shock and vibration and include TPM 2.0 and Secure Boot. Thanks to PICMG standardisation, you can upgrade to a new CPU generation without redesigning your carrier board.
Machine vision, edge AI, industrial automation, medical imaging, transportation and digital signage. Tokhatec supplies Congatec and SECO Type 6 modules with Intel Core i3, i5, i7 and Xeon options and secures long-term availability through the OEM+ Program.